Shin-Puu Jeng,: search on Z-Library

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1

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Reliability evaluation of a CoWoS-enabled 3D IC package

Banijamali, Bahareh, Chiu, Chien-Chia, Hsieh, Cheng-Chieh, Lin, Tsung-Shu, Hu, Clark, Hou, Shang-Yun, Ramalingam, Suresh, Jeng, Shin-Puu, Madden, Liam, Yu, Doug. C. H.

Year:

2013

Language:

english

File:

PDF, 970 KB

english, 2013

2

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Multilayer RDL Interposer for Heterogeneous Device and Module Integration

Lin, Yi-Hang, Yew, M.C., Chen, S.M., Liu, M.S., Kavle, Pravin, Lai, T.M., Yu, C.T., Hsu, F.C., Chen, C.S., Fang, T.J., Hsu, C.K., Lee, K.C., Lin, C.H., Lin, P.Y., Jeng, Shin-Puu

Year:

2019

Language:

english

File:

PDF, 650 KB

english, 2019

3

Polymers for high-performance interconnects: Invited lecture

Kelly J. Taylor, Shin-Puu Jeng, Mona Eissa, Justin Gaynor, Hoan Nguyen

Journal:

Microelectronic Engineering

Year:

1997

Language:

english

File:

PDF, 271 KB

english, 1997

4

Parylene Copolymers

Taylor, Kelly J., Eissa, Mona, Gaynor, Justin F., Jeng, Shin-Puu, Nguyen, Hoan

Journal:

MRS Proceedings

Year:

1997

Language:

english

File:

PDF, 489 KB

english, 1997

5

[IEEE 2017 Symposium on VLSI Circuits - Kyoto, Japan (2017.6.5-2017.6.8)] 2017 Symposium on VLSI Circuits - High density 3D fanout package for heterogeneous integration

Jeng, Shin-Puu, Chen, S. M., Hsu, F. C., Lin, P. Y., Wang, J. H., Fang, T. J., Kavle, P., Lin, Y. J.

Year:

2017

Language:

english

File:

PDF, 1.07 MB

english, 2017

6

[IEEE 1995 International Symposium on VLSI Technology, Systems, and Applications. - Taipei, Taiwan (31 May-2 June 1995)] 1995 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers - Implementation of low-dielectric-constant materials for ULSI circuit performance improvement

Shin-Puu Jeng,, Mi-Chang Chang,, Ting, L., Taylor, K., Lee, C., McAnally, P., Havemann, R.H.

Year:

1995

Language:

english

File:

PDF, 377 KB

english, 1995

7

Preferential sputtering of Ni/Cr(110)

Shin-Puu Jeng, Paul H. Holloway

Journal:

Surface Science

Year:

1990

Language:

english

File:

PDF, 281 KB

english, 1990

8

[IEEE 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2016.10.26-2016.10.28)] 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Lidded FCCSP warpage evaluation: Process modeling and characterization of the effect of viscoelasticity and cured shrinkage for molded underfill

Yeh, Shu-Shen, Lin, Po-Yao, Jeng, Shin-Puu, Lin, Wen-Yi, Yew, Ming-Chih, Lee, Kuang-Chun, Wang, Jin-Hua, Lai, Po-Chen, Leu, Shyue-Ter

Year:

2016

Language:

english

File:

PDF, 1.21 MB

english, 2016

9

Surface passivation of Ni/Cr alloy at room temperature

Shin-Puu Jeng, Paul H. Holloway, Chris D. Batich

Journal:

Surface Science

Year:

1990

Language:

english

File:

PDF, 690 KB

english, 1990

10

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - 3D Heterogeneous Integration with Multiple Stacking Fan-Out Package

Hsu, Feng-Cheng, Lin, Jackson, Chen, Shuo-Mao, Lin, Po-Yao, Fang, Jerry, Wang, Jin-Hua, Jeng, Shin-Puu

Year:

2018

Language:

english

File:

PDF, 521 KB

english, 2018

11

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Hybrid Fan-out Package for Vertical Heterogeneous Integration

Chuang, Po-Yao, Lin, M.-L., Hung, S.-T., Wu, Y.-W., Wong, D.-C., Yew, M.-C., Hsu, C.-K., Liao, L.-L, Lai, P.-Y., Tsai, P.-H., Chen, S.-M., Cheng, S.-K., Jeng, Shin-Puu

Year:

2020

File:

PDF, 392 KB

2020

12

The impact of scaling on metal thickness for advanced back end of line interconnects

Hsueh-Chung Chen, Su-Chen Fan, Jian-Hong Lin, Yi-Lung Cheng, Shin-Puu Jeng, Chii-Ming Wu

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 269 KB

english, 2004

13

(110) surfaces determined by resonant photoemission

Zhang, Zhaoming, Jeng, Shin-Puu, Henrich, Victor E.

Journal:

Physical Review B

Year:

1991

Language:

english

File:

PDF, 471 KB

english, 1991

14

Process Integration and Manufacturasility Issues for High Performance Multilevel Interconnect

Jeng, Shin-Puu, Havemann, Robert H., Chang, Mi-Chang

Journal:

MRS Proceedings

Year:

1994

Language:

english

File:

PDF, 739 KB

english, 1994

15

[IEEE 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2015.10.21-2015.10.23)] 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - A novel integrated warpage prediction model based on characterization of viscoelasticity in time domain and chemical shrinkage for molded underfill

Shu-Shen Yeh,, Po-Yao Lin,, Shin-Puu Jeng,, Wen-Yi Lin,, Ming-Chih Yew,, Kuang-Chun Lee,, Shyue-Ter Leu,, Kuo-Chuan Liu,

Year:

2015

Language:

english

File:

PDF, 998 KB

english, 2015

16

[IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - Chip-packaging interaction in Cu/very low-k interconnect

Wei, Hsiu-Ping, Tsai, Hao-Yi, Liu, Yu-Wen, Chen, Hsien-Wei, Jeng, Shin-Puu, Yu, Douglas CH

Year:

2009

Language:

english

File:

PDF, 487 KB

english, 2009

17

Changes induced at Ni/Cr alloy surfaces by annealing and oxygen exposure

Shin-Puu Jeng, Paul H. Holloway, Douglas A. Asbury, Gar B. Hoflund

Journal:

Surface Science

Year:

1990

Language:

english

File:

PDF, 960 KB

english, 1990

18

[IEEE Symposium on VLSI Technology - Kyoto, Japan (1997.06.12-1997.06.12)] Symposium on VLSI Technology - A Novel TiSi/sub 2/TiN Clad Local Interconnect Technology

Shin-Puu Jeng,, West,, Wyke,

Year:

1993

Language:

english

File:

PDF, 227 KB

english, 1993

19

[IEEE 1994 VLSI Technology Symposium - Honolulu, HI, USA (7-9 June 1994)] Proceedings of 1994 VLSI Technology Symposium - A planarized multilevel interconnect scheme with embedded low-dielectric-constant polymers for sub-quarter-micron applications

Shin-Puu Jeng,, Mi-Chang Chang,, Kroger, T., McAnally, P., Havemann, R.H.

Year:

1994

Language:

english

File:

PDF, 202 KB

english, 1994

20

[IEEE 2000 Symposium on VLSI Technology. Digest of Technical Papers - Honolulu, HI, USA (13-15 June 2000)] 2000 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.00CH37104) - A novel CVD polymeric anti-reflective coating (PARC) for DRAM, flash and logic device with 0.1 μm CoSi/sub 2/ gate

Kung Linliu,, Mai-Rue Kuo,, Yi-Ren Huang,, Shu-Chun Lin,, Shin-Puu Jeng,, Chun-Shing Chen,

Year:

2000

Language:

english

File:

PDF, 388 KB

english, 2000

21

[IEEE 2006 International Symposium on VLSI Technology, Systems, and Applications - Hsinchu, Taiwan (2006.4.24-2006.4.24)] 2006 International Symposium on VLSI Technology, Systems, and Applications - Resistance Increase in Metal Nano-wires

Chen, Hsueh-chung, Chen, Hsien-wei, Jeng, Shin-puu, Wu, Chii-ming, Sun, Jack

Year:

2006

Language:

english

File:

PDF, 2.05 MB

english, 2006

22

Interference between 3D → 3D electron-exchange transitions and interband excitations in MnO(100)

Shin-Puu Jeng, Victor E. Henrich

Journal:

Solid State Communications

Year:

1992

Language:

english

File:

PDF, 350 KB

english, 1992

23

chemisorption on CoO(100): A resonant-photoemission study

Jeng, Shin-Puu, Zhang, Zhaoming, Henrich, Victor E.

Journal:

Physical Review B

Year:

1991

Language:

english

File:

PDF, 278 KB

english, 1991

24

Process Integration Of Low-Dielectric-Constant Materials

Jeng, Shin-Puu, Taylor, Kelly, Chang, Mi-Chang, Ting, Larry, Lee, Charles, Mcanally, Peter, Seha, Tom, Numata, Ken, Tanaka, Tsuyoshi, Havemann, Robert H.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 1.69 MB

english, 1995

25

Material Characterization Of Methyl Siloxane Sogs

Numata, Ken, Seha, Thomas R., Jeng, Shin-Puu, Tanaka, Tsuyoshi

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 354 KB

english, 1995

26

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Ultra-Thin Package Board Level Drop Impact Modeling and Validation

Yeh, Shu-Shen, Lin, P. Y., Yew, M. C., Lin, W. Y., Lee, K. C., Yang, C. C., Wang, J. H., Lai, P. C., Hsu, C. K., Jeng, Shin-Puu

Year:

2019

File:

PDF, 766 KB

2019

27

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Interfacial Strength Characterization and Simulation of the Stacked Copper-Polymer Structures in Fan-out Packages

Hsu, Chia-Kuei, Lin, Po-Yao, Lin, Wen-Yi, Yew, Ming-Chih, Yeh, Shu-Shen, Lee, Kuang-Chun, Wang, Jin-Hua, Lai, Po-Chen, Yang, Che-Chia, Jeng, Shin-Puu

Year:

2018

Language:

english

File:

PDF, 362 KB

english, 2018

28

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - An Integrated Warpage Prediction Model Based on Chemical Shrinkage and Viscoelasticity for Molded Underfill

Yeh, Shu-Shen, Lin, Po-Yao, Lee, Kuang-Chun, Wang, Jin-Hua, Lin, Wen-Yi, Yew, Ming-Chih, Lai, Po-Chen, Hsu, Chia-Kuei, Yang, Che-Chia, Jeng, Shin-Puu

Year:

2018

Language:

english

File:

PDF, 684 KB

english, 2018

29

[IEEE 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2018.10.24-2018.10.26)] 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Warpage Modeling and Characterization of the Cure-dependent Chemical Shrinkage and Viscoelastic Relaxation for Cured Molding Process

Yeh, Shu-Shen, Lin, Po-Yao, Lee, Kuang-Chun, Wang, Jin-Hua, Lin, Wen-Yi, Yew, Ming-Chih, Lai, Po-Chen, Hsu, Chia-Kuei, Yang, Che-Chia, Liao, Li-Ling, Lin, Yu-Sheng, Jeng, Shin-Puu

Year:

2018

Language:

english

File:

PDF, 8 KB

english, 2018

30

Direct observation of defect-induced surface covalency in ionic CoO (1 0 0)

Shin-Puu Jeng, Victor E. Henrich

Journal:

Solid State Communications

Year:

1990

Language:

english

File:

PDF, 504 KB

english, 1990

31

[IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - A self-aligned airgap interconnect scheme

Chen, Hsien-Wei, Jeng, Shin-Puu, Tsai, Hao-Yi, Liu, Yu-Wen, Wei, Hsiu-Ping, Yu, Douglas C.H., Sun, Y.C.

Year:

2009

Language:

english

File:

PDF, 729 KB

english, 2009

32

[IEEE 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei (2017.10.25-2017.10.27)] 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Fan-out wafer molding process optimization using cure-dependent viscoelastic modeling and characterizations

Yeh, Shu-Shen, Lin, Po-Yao, Lee, Kuang-Chun, Wang, Jin-Hua, Lin, Wen-Yi, Yew, Ming-Chih, Lai, Po-Chen, Hsu, Chia-Kuei, Yang, Che-Chia, Jeng, Shin-Puu

Year:

2017

Language:

english

File:

PDF, 1.45 MB

english, 2017

33

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Warpage Modeling and Characterization of the Viscoelastic Relaxation for Cured Molding Process in Fan-Out Packages

Yeh, Shu-Shen, Lin, Po-Yao, Lee, Kuang-Chun, Wang, Jin-Hua, Lin, Wen-Yi, Yew, Ming-Chih, Lai, Po-Chen, Leu, Shyue-Ter, Jeng, Shin-Puu

Year:

2017

Language:

english

File:

PDF, 506 KB

english, 2017

34

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Viscoelastic Modeling for Heterogeneous Fan-out Wafer Molding Process

Yeh, Shu-Shen, Lin, P. Y., Lee, K. C., Yew, M. C., Yang, C. C., Wang, J. H., Hsu, C. K., Lai, P. C., Tseng, Dion, Cheng, S. K., Jeng, Shin-Puu

Year:

2020

File:

PDF, 734 KB

2020

35

[IEEE 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei (2017.10.25-2017.10.27)] 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Characterization methodologies for copper/polymer interfacial strength

Hsu, Chia-Kuei, Lin, Po-Yao, Lin, Wen-Yi, Yew, Ming-Chih, Yeh, Shu-Shen, Lee, Kuang-Chun, Wang, Jin-Hua, Lai, Po-Chen, Yang, Che-Chia, Jeng, Shin-Puu

Year:

2017

Language:

english

File:

PDF, 1.14 MB

english, 2017

36

[IEEE 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) - Hsinchu, Taiwan (2014.4.28-2014.4.30)] Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) - CoWoS™ technologies

Year:

2014

Language:

english

File:

PDF, 476 KB

english, 2014

37

Satellite structure in the photoemission spectra of MnO(100)

Jeng, Shin-Puu, Lad, Robert J., Henrich, Victor E.

Journal:

Physical Review B

Year:

1991

Language:

english

File:

PDF, 360 KB

english, 1991

38

[IEEE 2008 International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2008.06.1-2008.06.4)] 2008 International Interconnect Technology Conference - A Self-Aligned Air Gap Interconnect Process

Chen, Hsien-Wei, Jeng, Shin-Puu, Tsai, Hao-Yi, Liu, Yu-Wen, Yu, CH, Sun, YC

Year:

2008

Language:

english

File:

PDF, 2.97 MB

english, 2008

39

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Interfacial Strength Characterization and Simulation of the Stacked Copper-Polymer Structures in Fan-out Packages

Hsu, Chia-Kuei, Lin, Po-Yao, Lin, Wen-Yi, Yew, Ming-Chih, Yeh, Shu-Shen, Lee, Kuang-Chun, Wang, Jin-Hua, Lai, Po-Chen, Yang, Che-Chia, Jeng, Shin-Puu

Year:

2018

File:

PDF, 362 KB

2018

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